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Welcome to ICMPC 2026

2026 3rd International Conference on Materials Physics and Composites


Entering the 21st century, materials are listed as one of the four pillars of modern civilisation, not only as the basic elements of people's daily life, but also as indispensable components in major high-tech fields such as energy, information, advanced manufacturing, etc., with numerous examples of their applications.

Material physics and composites, as cutting-edge fields, are of great significance to the advancement of science and technology and the development of society. Therefore, we sincerely invite all experts and scholars to attend the 2026 3rd International Conference on Materials Physics and Composites (ICMPC 2026). The conference will be held on June 26-28 2026 in Kunming, China. The conference will attract leading researchers and practitioners to present and exchange information on the latest developments in materials physics and composites, and will also focus on how to translate research results into practical applications for industrial upgrading and sustainable development.

The conference programme will feature keynote speeches by renowned scholars in the field and oral or poster presentations by scholars from around the world in Kunming. Participants will have the opportunity to meet with researchers and industry experts to exchange new ideas and application experiences. Scholars from home and abroad are welcome to submit papers and attend the conference.

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CFP

Submission Deadline

April 17, 2026

Notification Deadline

May 22, 2026

Registration Deadline

June 6, 2026

Conference Dates

June 26-28, 2026

Call For Papers

· Material physics

· Material physics and structure

· Material physics and chemistry

· ...

· Composite material

· Advanced composite materials

· Computational materials science

· ...

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Publication

All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings and submitted to EI Compendex, Scopus for indexing.

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